A Novel Low-Cost and Low-Loss DS-GWG Solution using Advanced Glass Packages at V-Band

This paper presents a novel low-loss and low-cost double-sided gap waveguide (DS-GWG) fabricated by glass packaging process for V-band applications. The proposed structure is stacked with three layers of inexpensive glass substrates utilizing a dry film bonding process. The middle layer is distributed with a large number of electromagnetic band gap (EBG) units, composed of double-sided metal rings and non-vertical through glass vias (TGV), to prevent the leakage of the electro-magnetic wave within the gap. Most of the glass in the transmission area is removed by the laser-induced wet etching (LIWE) process to achieve low transmission loss. Its excellent transmission performance has been verified by simulation and measurement in the V-band. The measured transmission loss is as low as 0.02 dB/mm, exhibiting an outstanding low-loss performance. Moreover, the newly proposed glass-substrate-based DS-GWG solution behaves at low cost and low loss, and it is very suitable for millimeter-wave applications.