Millimeter-Wave and Sub-THz Wireless the Wire Towards 6G

The Lead6G project targets a monolithic, highly integrated THz chipset, which includes the active channels and the antennas on one piece of silicon to overcome the challenges for the THz chipset: power, packaging, size. The multi-channel interpolation-based beamforming could improve the radiated power and receiver sensitivity while decreasing its power consumption. The on-chip dual-polarized antenna array would simplify the packaging at THz frequency and increase its bandwidth. The low-loss on-chip metamaterial structure would tightly confine electromagnetic waves and optimize chipset radiation.