A Compact Three-dimensional Wilkinson Power Divider Based on TSV

This paper proposed a compact Three-Dimensional (3-D) Wilkinson Power Divider (WPD) based on Through-Silicon Via (TSV). With the application of the transmission line theory and matrix analysis method, the microstrip line structure is transformed into a lumped parameter $\pi$ model, which greatly reduces the device size and improves the integration degree on the premise of meeting the performance requirements. HFSS is used to simulate and verify the proposed 3-D WPD based on TSV. The results show that in the frequency range of 4.6GHz to 5.6GHz, the return loss is lower than – 17dB, the isolation is lower than-18dB, and the insertion loss is lower than-3.4dB. In addition, the circuit size of the proposed 3-D WPD based on TSV is only $0.274\times 0.308\mathrm{mm}^{2}(0.017\times 0.019\lambda \mathrm{g}^{2})$.