Electrothermal Coupling Response of Multi-layer PCB Interconnects Based on Tensorial Analysis Network

An efficient method for transient thermal analysis of interconnects is proposed for interconnected circuits with complex stack structures and multi excitations. The method of tensorial analysis network combined with the simplified thermal RC model (RC-TAN) is proposed for the first time and applied to the coupled electrothermal analysis in this paper. The effectiveness of the method is verified by comparing the results with the finite element method (FEM) simulation. The results show that this method saves 99.8% of the computation time compared to FEM. The maximum temperature error is only 2.7% and the steady-state error is less than 1%. We will also improve the accuracy of the temperature rise phase by increasing the order of the thermal RC model.