Physics-driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages

Express reliability assessment method has been developed for board level temperature cycling solder joint reliability of System-in-Packages (SiP) for mobile applications through the validated regression equation by combining finite element analysis (FEA) and statistical analysis. The developed equation accuracy for calculating solder joint strain energy density was validated by FEA simulation results and experimental data. This proposed approach for new package reliability assessment considerably reduces cycle time from days to minutes since it does not require numerical FEA simulations for life prediction.