Micro Transfer Printing Various Thickness Components Directly from Dicing Tape

Micro transfer printing (MTP) is a useful method for heterogenous integration of micro-scale devices. Devices that are micro transfer printed can be a variety of sizes but are always typically thin (less than
$20\mu \mathrm{m}$
) and employ a sacrificial layer that can be selectively etched to enable to device to be pickable. In this paper, we expand the capability of MTP by picking and printing a wide range of device thicknesses. In addition to device thickness, we also explore a new technique for MTP. This new technique does not require a sacrificial layer, but instead picks components directly from exposed ultraviolet (UV) dicing tape. This new method of MTP also allows for the transfer of larger components, several millimeters in length and width, than previously thought possible using traditional micro transfer printing.