HBM3 Modules on Latest High Density Organic Laminate-Signal Integrity Design and Analysis with Interconnect Budget Results

This paper provides the full HBM3 system interconnect signal integrity design, link budget analysis and a positive timing margin closure solution for the latest generation high density organic laminate capable of line widths and spaces of
$1.5\mu \mathrm{m}$
. Also analyzed is the high density organic packaging scalability that includes inter-layer misregistration and dielectric thickness variations.