Investigation on Embedded Microchannel Heatsink for 2.5-D Integrated Package

Thermal integrity is known to be one of the most challenging barriers in the development of 2.5-D/3-D integrated packaging systems. In this work, an embedded microchannel heatsink (EMCHS) with through-silicon via (TSV)-etched micropin-fins is designed for the thermal management of 2.5-D packages. Numerical simulation models are developed to estimate the thermal and mechanical performances of the EMCHSs and packages. The accuracy of the models is validated first, and then some model simplification means are proposed to reduce the models’ order, improving the computing time and resource cost of simulation. To optimally design the EMCHS, achieving a tradeoff between pump power and heat-sinking capability, an optimum design approach is proposed. In this approach, the gray relational analysis is implemented to search for the optimal design parameters and simulation models are employed to carry out fast performance evaluation. Simulation results indicate that great improvements in both heat-sinking capability and mechanical reliability are achieved in the optimized EMCHS and 2.5-D package.