Investigation of Surface Temperature for Sensitive Element of Micromechanical Accelerometer During Plasma Etching Using Finite Element Method

A mathematical model of the thermal processes for the deep reactive-ion etching is proposed to determine the substrate surface temperature. Results of numerical modeling of the heating process for the sensitive element of a micromechanical accelerometer during the deep reactive ion etching are presented. A total variation of the polymer deposition rate during the Bosch process was determined.