A Junction Temperature Monitoring Method Based on the Combined TSEPs for Power Devices

Junction temperature monitoring is helpful for the reliability evaluation of power devices. However, many junction temperature monitoring methods are afflicted by the issue of load current dependence. To address this, this paper proposes a junction temperature monitoring method based on the combined thermo-sensitive electric parameters (TSEPs). In this method., the turn-off delay time is used as the junction temperature indicator., and the parameter dependence analysis of this indictor is accordingly provided. It is revealed from the analysis that the behavior of the turn-off time is adversely affected by the troublesome problem of load current dependence. Considering this., another TESP., i.e., the combined turn-off delay time., is introduced in the proposed junction temperature monitoring method. By doing so., an achievement of load current independence is developed. Extensive double-pulse tests and experimental tests are conducted to verify the effectiveness of the proposed unction temperature monitoring method.