Enhancing the Accuracy of Reliability Prediction for Electronic Equipment through Improving Models and Calculation Methods

Complex high-speed electronic systems have been relevant for research in terms of the vibration load effect thereon. Currently, printed circuit board manufacturing technologies are a well-established production mechanism to fabricate high-quality products. However, despite high reliability of electronic equipment, there is failure probability in the design of printed circuit board due to critical deformations and mechanical stresses under certain (harsh) external conditions of influencing factors. In this regard, it is urgent to consider, analyze and prevent such critical deformations in printed circuit board design. This paper considers mathematical, simulation, algorithmic, and software methods for analyzing and calculating critical deformations and mechanical stresses in standard printed circuit board design to increase its mechanical strength. The research aims to improve simulation models and design methods for electronic equipment to enhance the accuracy of reliability prediction thereof. An improved mathematical and simulation model for calculating mechanical stresses and displacements of a printed circuit board have been developed. An algorithm for applying the improved mathematical model has been proposed, and a program for calculating a specifying coefficient has been elaborated.