Study on thermal stress behavior of mold type POL tile

The power module industry requires smaller common packages to meet the rapidly growing demand. Power Over Lay (POL) tile is a promising candidate to meet these requirements. In this report, we will discuss the behavior of mold type POL tiles under thermal stress and the challenges they face. Temperature cycling tests were performed on several POL tile Cu wiring designs and mold resin combinations. The combination of the design with Cu wiring on the entire surface of the device and the use of high-toughness molding resin was demonstrated high reliability in temperature cycles. Thermal stress analysis results using a full-scale model of mold type POL tile with this combination showed decrease in plastic strain at Cu via connection and low damage level at pad opening portion.