Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

This article presents the antenna-integrated glass interposer for
$D$
-band 6G wireless applications using die-embedding technology. We implement the die-embedded package on glass substrates and characterize the electrical performance in the
$D$
-band. The electrical characterization employs embedded test dies with the 50-
$\Omega $
ground–signal–ground (GSG) ports and coplanar waveguides. We achieve low-loss die-to-package transitions by using staggered dielectric vias, which are compared with the transitions of wire-bonding and flip-chip assembly. This article provides detailed information on the design, modeling, fabrication, and characterization of the die-to-package interconnects. This article also demonstrates the integration of microstrip patch antenna array and embedded dies in the
$D$
-band. The results show superior electrical performance provided by the die-embedded glass interposer. The die-to-package interconnect exhibits good matching (less than −10-dB S11) and low loss (0.2-dB loss) in the
$D$
-band. The integrated
$1\times8$
patch antenna array shows 11.6-dB broadside gain and good matching with the embedded die. In addition, by using a temporary carrier, the antenna-integrated glass interposer also has great potential for further heterogeneous integration and thermal management.