Effectiveness of Slow Cure Non-Conductive Film in Void elimination

This paper studies formation of NCF (non-conductive film) voids and verifies the effectiveness of slow-cure approach in terms of void elimination. Two collective bonding conditions were tested with one leg designed to be low in curing degree prior to the 2
^nd
phase of collective bond where the high force is applied. The result reveals that the NCF voids form also after the 2
^nd
phase of collective bond, indicating the NCF decomposes during bonding. The precured NCF on the other hand has better thermal resistance and turned out not forming the post-bonding voids.