High-Density 56Gbps PAM4 Package Design Enablement with Cost and Performance Optimization

The rapid demand for higher density and higher data rate Serdes signals in a single high-speed integrated circuit (IC) package is continuously expanding for emerging data-center, networking and storage applications. Hence, this paper discusses cost-effective substrate design solution for high-density 56Gbps PAM4 channels in a single package by enabling back-side trace design strategy. This is critical for low die-package size ratio packages whereby the die edge is close to package edge owing to package form factor constraint. The package transceivers signal layer-to-layer impedance change, and via-to-via coupling are carefully studied using 3D full-wave electromagnetic (EM) tool solver for optimal performance to meet package electrical specifications. By implementing the proposed back-side trace design strategy, it is estimated to potentially save up to 25% substrate cost comparing to the baseline design owing to package layer count reduction and package size increase avoidance.