The Stress Analysis of Moisture-Thermal Coupling Based on an Advanced 3D Packaging

The three-dimensional (3D) chip stacking package provides numerous advantages to 3D plastic packaging. However, moisture and thermal can pose a risk to the integrity of the package. Hence, it is critical to examine the effects of hygrothermal stress allocation on the reliability of 3D chip stacking packages. Based on the previous work, this paper proposes an innovative 3D chip stacking package structure to study the influence of hygrothermal coupling factors on its reliability. The evolution of packaging structures relies on the continual evolution of the packaging process. This study’s new development structure has not been adequately investigated, particularly in hygrothermal coupling. The constructed 3D stacked package chip is hygrothermal simulated in this work using ANSYS finite element simulation software. Moisture and thermal stresses were coupled. The two were then compared to verify that neither moisture nor thermal stresses are negligible. These packages are subject to the most significant reliability risk impact at the solder ball corners. Thermal moisture stress is more prominent in the lower solder ball than the upper layer and the outer ring than the inner. In this research, the ANSYS tool is used for precise modeling simulation and assessment, providing support and a reference for the smooth simulation of wet thermal coupling in innovative package structures. In addition, the impact of different solder ball sizes on the package is investigated from a practical standpoint. The results provide significant guidance for designing this package’s structure and add to the reliability of the design.