Metal Additive Microfabricated Microfluidic Packages for Integrated Thermal Management In Power Application

This abstract presents the metal additive microfabrication of System-in-Packages (SiP) demonstrated by quad flat no-lead (QFN) packages with an integrated microfluidic thermal management system for power applications. Direct Metal Laser Sintering (DMLS) was employed to fabricate these packaging devices from 316L stainless steel precursor powder. The use of singlephase water cooling on these microfluidic packages reduced the steady state thermal resistance to 1.57⁰C/W (pin-fin) and 1.59⁰C/W (channel) compared to 5.25⁰C/W for a conventional package. Several experimental data showed that the average surface temperature can also be reduced to around 28⁰C from around 45⁰C (for conventional package) employing microfluidic water cooling. The possibility of further reduction of surface temperature will be studied.