A Method for Extracting Features of Infrared Cloud Image Data of the Printed Circuit Board

Printed circuit boards (PCBs) are an integral part of sophisticated fighter jets and other weapons that need high reliability. The tremendous integration and complexity of PCBs cannot be satisfied by intrusive examination techniques. Meanwhile, because to its considerable benefit of non-intrusive inspection, infrared cloud imaging technology has a wide range of potential applications in the state identification of PCBs. The non-intrusive equipment PCB state identification technology is developed in this study. A temperature field model of the PCB is established. The temperature fields of typical components are analyzed. Two methods of extracting component boundaries in infrared cloud images are proposed including the temperature gradient threshold operator and temperature Laplace threshold operator. The infrared cloud image obtained by thermal simulation of the PCB verifies that the proposed methods can accurately extract the edge features of components from the infrared cloud image. Edge recognition methods will provide a basis for mining more data features of infrared cloud images.