Loading [MathJax]/extensions/MathMenu.js

V. I. Mamyshev - IEEE Xplore Author Profile

Scheduled Maintenance on Monday 1/13/2025

Single article sales and account management will be unavailable from 5:00 AM - 7:00 PM ET (09:00 - 23:00 UTC). We apologize for the inconvenience.

IEEE.org
IEEE Xplore
IEEE SA
IEEE Spectrum
More Sites

- Donate
- Personal Sign In

Access provided by:

MIT Libraries

Access provided by:

MIT Libraries

ADVANCED SEARCH

Author details

V. I. Mamyshev

Also published under: Valentin I. Mamyshev, V. Mamyshev

Publications

16

Citations

52

Publications by Year

19982018

Co-Authors:

Leonid P. BabichV. K. BaranovA. A. BazanovO. M. BurencovOleg M. Burenkov

Show All Co-Authors (52)

V. I. Mamyshev

Also published under: Valentin I. Mamyshev, V. Mamyshev

Affiliation

Russian Federal Nuclear Center

All-Russia Research Institute of Experimental Physics (VNIIEF)

Sarov, Russian

Publication Topics

Explosive,
Magnetic Field,
Chamber Wall,
Magnetic Pressure,
Plasma Temperature,
X-ray Pulses,
Aluminum Tube,
Anode Surface,
Calculation Results,
Cascade System,
Central Electrodes,
Chamber Design

Biography

Valentin I. Mamyshev, photograph and biography not available at the time of publication.(Based on document published on 29 February 2016).

Publications

16

Citations

52

Publications by Year

19982018

Co-Authors:

Leonid P. Babich
V. K. Baranov
A. A. Bazanov
O. M. Burencov
Oleg M. Burenkov

Show All Co-Authors (52)

Author's Published Works

Search History

Showing 1 of 1 result

Conferences (1)

Sort

Filter Results

Show

Subscribed Content

Open Access Only

Range
Single Year
C.H. Yu(1)
M.F. Chen(1)
M.H. Tseng(1)
C.W. Hsiao(1)
W.J. Wu(1)
Integrated Interconnect and Packaging Division Research and Development, Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, Taiwan(1)
2009 IEEE International Electron Devices Meeting (IEDM)(1)
IEEE(1)
Baltimore, MD, USA(1)
Etching(1)
Thin Processes(1)

Select All on Page

Sort By

Results

Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

D.Y. Chen;W.C. Chiou;M.F. Chen;T.D. Wang;K.M. Ching;H.J. Tu;W.J. Wu;C.L. Yu;K.F. Yang;H.B. Chang;M.H. Tseng;C.W. Hsiao;Y.J. Lu;H.P. Hu;Y.C. Lin;C.S. Hsu;Winston S. Shue;C.H. Yu

2009 IEEE International Electron Devices Meeting (IEDM)

Year: 2009 | Conference Paper |

Cited by: Papers (44) | Patents (2)

HTML

High density through-silicon-via (TSV) and cost-effective 3D die-to-wafer integration scheme are proposed as best-in-class foundry solutions for high-end CMOS chips at 28 nm node and beyond. Key processes include: TSV formation, extreme thinning of the TSV wafer and die-to-wafer assembly. The impact of extreme thinning on device threshold voltage, leakage currents, and Ion-Ioff characteristics of ...Show More

Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

D.Y. Chen;W.C. Chiou;M.F. Chen;T.D. Wang;K.M. Ching;H.J. Tu;W.J. Wu;C.L. Yu;K.F. Yang;H.B. Chang;M.H. Tseng;C.W. Hsiao;Y.J. Lu;H.P. Hu;Y.C. Lin;C.S. Hsu;Winston S. Shue;C.H. Yu

2009 IEEE International Electron Devices Meeting (IEDM)

Year: 2009 | Conference Paper |

IEEE Personal Account

Change username/password

Purchase Details

Payment Options
View Purchased Documents

Profile Information

Communications Preferences
Profession and Education
Technical interests

Need Help?

US & Canada: +1 800 678 4333
Worldwide: +1 732 981 0060
Contact & Support

Follow

About IEEE Xplore | Contact Us | Help | Accessibility | Terms of Use | Nondiscrimination Policy | IEEE Ethics Reporting | Sitemap | IEEE Privacy Policy

A public charity, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.

© Copyright 2025 IEEE - All rights reserved, including rights for text and data mining and training of artificial intelligence and similar technologies.

IEEE Account

Change Username/Password
Update Address

Purchase Details

Payment Options
Order History
View Purchased Documents

Profile Information

Communications Preferences
Profession and Education
Technical Interests

Need Help?

US & Canada: +1 800 678 4333
Worldwide: +1 732 981 0060
Contact & Support

About IEEE Xplore
Contact Us
Help
Accessibility
Terms of Use
Nondiscrimination Policy
Sitemap
Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.
© Copyright 2025 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.

Test Whats new message.