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A Case Study of Multiobjective Automatic Design for Active Neutral Point Clamped Inverter Based on Machine Learning
Jianing Wang;Ruiyuan Wang;Zhicheng Gao;Feishuang Sun;Weihao Hu
IEEE Transactions on Industrial Electronics
Year: 2024 | Early Access Article |
The traditional converter design follows the sequential process that usually contains design of topology, modulation, components, performances and their internal iterations. This method relies heavily on manual experience and are time-consuming, especially for multiobjective design (MOO) emphasized by using wide band gap devices that exacerbate the conflict between design objectives. Computer-aide...Show More
Current Equalization Strategy for Three-Phase LLC Converter Based on Integral Phase-Shift Control
2024 IEEE 7th International Electrical and Energy Conference (CIEEC)
Year: 2024 | Conference Paper |
With the rapid development of the new energy industry, the demand for high-performance power electronic devices is growing. The three-phase interleaved parallel LLC resonant converter has been widely used due to its characteristics such as high power density, low electromagnetic interference, high efficiency, wide input range, small output current ripple, and low component stress. However, differe...Show More
The Packaging Design of SiC Power Modules Based on Silver Sintering Technology
2024 IEEE 7th International Electrical and Energy Conference (CIEEC)
Year: 2024 | Conference Paper |
This article introduces the packaging design of a SiC power module with a double-sided pressure-assisted silver sintering process. Initially, the structure of the power module is optimized and verified through electro-thermal-mechanical multiphysics field simulation experiments. Subsequently, the assembly processes of the module are further described. The module is characterized by the use of pres...Show More
Thermal resistance measurement and failure analysis of Multi-discrete SiC MOSFET System Module
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
Year: 2024 | Conference Paper |
At present, most of the power cycling tests only concentrate on researching the power device itself. However, in the actual electric vehicle inverters, connection layers are present between the power device and the heatsink, such as thermally conductive silicone grease. In addition to the internal packaging material for power device, the aging of external connection layer can also cause an increas...Show More
Online Prediction Method for the Remaining Useful Life of Power Devices Based on Composite Indicator
Power switching devices are key components of power conversion systems. Their lifetime assessment is critical to the system's safe operation. This article proposes a method for estimating the remaining useful life (RUL) based on the fusion of multiple monitoring indicators to address the problems of low prediction accuracy, low utilization of monitoring indicators, and partial failure information ...Show More
Voltage Control Embedded Resilient Distribution System Restoration Considering Uncertainties
Xiaodong Yang;Zhengli Hu;Hui Fang;Lijian Ding;Jinyu Wen;Qiuwei Wu;Lei Sun;Jianing Wang
The voltage issue in fault scenarios is more challenging than that in normal operation for distribution system (DS) with high renewable energy penetration. Nevertheless, most existing studies focused on increasing the restored loads using reconfiguration and dispatching of distributed generations, where the voltage security issue during the distribution system restoration (DSR) process has not rec...Show More
A Comprehensive Design Method for Multichip Double-Sided Cooling Power Module With Multidimensional Self-and Mutual Inductances
The double-sided cooling (DSC) packaging configuration, distinguished by its low loop inductance and superior thermal performance, presents a promising solution for multichip silicon carbide (SiC) modules. Nevertheless, challenges persist in the design aspects of current balancing and thermal coupling. This article proposes a comprehensive design method that utilizes the multidimensional self-and ...Show More
Efficiency-Power Density Multi-Objective Optimization Design of LLC Resonant Converter Based on Deep Reinforcement Learning
2023 IEEE 6th International Electrical and Energy Conference (CIEEC)
Year: 2023 | Conference Paper |
Cited by: Papers (1)
As all knows, the dramatic improvement in the performance of wide band gap devices, such as SiC devices, can greatly increase the power density or efficiency of converters. However, with the increase of the switching frequency, the volume of the electrical electronic device has decreased significantly, but the loss has greatly increased. Therefore, the conflict between the converter device design ...Show More
Service Restoration with Voltage Control for Resilient Distribution Systems Incorporating Soft Open Points
2023 IEEE 6th International Electrical and Energy Conference (CIEEC)
Year: 2023 | Conference Paper |
Cited by: Papers (1)
High penetration distributed renewable energy makes it increasingly important to integrate voltage management into resilience enhancement research of distribution systems. To this end, this paper investigates distribution service restoration problem with real-time voltage control in distribution systems incorporating soft open points (SOPs). A resilient service restoration framework is proposed in...Show More
Magnetic Integrated Five-phase LLC Resonant Converter for Offshore Wind Power System
2023 IEEE 6th International Electrical and Energy Conference (CIEEC)
Year: 2023 | Conference Paper |
Cited by: Papers (1)
In the offshore wind power generation system, the high voltage DC (HVDC) system is an important scheme for the long-distance transmission of electric energy. Modular isolated DCDC converter, such as half bridge LLC converter, are connected in series to improve the voltage and power level of system. With the capacity improvement of offshore wind power generation system, isolated DCDC module with hi...Show More
A Reliable Packaging Design for 1200-V, 500-A SiC Half-bridge Modules with Junction Temperature over 200 °C
2023 IEEE 6th International Electrical and Energy Conference (CIEEC)
Year: 2023 | Conference Paper |
This paper presents a reliable packaging design for high-temperature SIC power modules. The packaging materials used in this package are able to maintain excellent mechanical and electrical characteristics at a temperature of at least 200°C. This is a necessary condition for the modules to be able to be used at high temperatures for a long time. The package also uses many advanced packaging proces...Show More
Comprehensive Analysis of Paralleled SiC MOSFETs Current Imbalance Under Asynchronous Gate Signals
Jianing Wang;Chen Wang;Shuang Zhao;Helong Li;Lijian Ding;Xun Shen;H. Alan Mantooth
Parallel-connected power device is an extensively applied solution in the industry to increase the current rating of the converter system. However, due to the undesired printed circuit board (PCB) layout or semiconductor fabrication tolerance, mismatched drain–source current, which speeds up the aging process of a certain device, can be introduced. The application of silicon carbide (SiC) devices ...Show More
Active Peltier Effect Heat Sink for Power Semiconductor Device Thermal Stability Enhancement
Lijian Ding;Ruya Song;Shuang Zhao;Jianing Wang;Homer Alan Mantooth
The failure caused by cumulative fatigue damage due to cyclical thermal stress is the dominant failure mode of power semiconductor devices, and it poses reliability concerns. In this regard, this research introduces a novel method for suppressing IGBT/mosfet chip thermal fluctuation. A Peltier effect heat sink (PEHS), which is a PN particle module embedded between the power devices base plate and ...Show More
Analysis of Blocking Capability Failure Mechanism in IGBT Module Under High Salt Spray Environment
High salt spray environment is a threat to the long-term stability and the robustness of an insulated gate bipolar transistor (IGBT) module. Failure mechanisms of IGBTs have been discussed in normal and high humidity environments, which in high salt spray environments is unclear and seldom reported. In this article, experiments in a high salt spray environment are conducted on wire-bonding IGBT mo...Show More
Five-Phase LLC Resonant DC/DC Converter Utilizing CLC Filter for Current Sharing
Multiphase LLC resonant converters are extensively used in the high-power scenarios. Compared with the common three-phase LLC resonant converters, a five-phase LLC (FPLLC) resonant converter can operate at higher power density with reduced current ripple, yet the current imbalance issue induced by the passive component tolerance is aggregated. In this article, the FPLLC converter topology is intro...Show More
Efficiency Optimization Design of Three-Level Active Neutral Point Clamped Inverter Based on Deep Reinforcement Learning
2022 IEEE 6th Conference on Energy Internet and Energy System Integration (EI2)
Year: 2022 | Conference Paper |
Cited by: Papers (3)
The traditional power electronic converter design mostly adopts the sequential design method, which relies on manual experience. In recent years, power electronics automation design has attracted much attention by rapidly optimizing the parameters of power electronic systems by computers, but most of them cannot provide design solutions to adapt to changes in design requirements. Taking the effici...Show More
Optimization Design of Silicon Carbide Power Module Based on Neural Network
2022 9th International Forum on Electrical Engineering and Automation (IFEEA)
Year: 2022 | Conference Paper |
Cited by: Papers (1)
Compared with Silicon materials, Silicon Carbide (SiC) devices are widely used due to their advantages of higher voltage resistance, higher temperature resistance, faster switching speed and bottom loss. Due to the low current carrying capacity of a single SiC chip, it is often necessary to apply multiple chips in parallel to improve the power level of the module. For the multi-chip parallel modul...Show More
Trajectory-Model-Based Switching Waveform Restoration Method for Accurate Dynamic Characterization of SiC Power MOSFET
Man Zhang;Shuang Zhao;Jianing Wang;Lijian Ding;Helong Li;Chenxu Yin;Xiyin Wang
2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC)
Year: 2022 | Conference Paper |
Characterization of the power semiconductor device switching process is critical to application since the switching speed determines the performance of the power converter. Accurate characterization of silicon carbide (SiC) devices is more difficult than the silicon counterparts due to the higher switching slew rate. It can lead to ringing in the power loop and finally the errors in characterizati...Show More
The Packaging Design for a SiC MOSFET Power Module with High-Temperature Characteristics
2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC)
Year: 2022 | Conference Paper |
Cited by: Papers (2)
This paper presents the design and testing of a Silicon Carbide (SiC) power module that can operate at 20°C for a long period of time. The overall structure of the module is relatively simple to ensure reliable electrical connections in a high-temperature environment. Silver sintering technology is used to attach the SiC chip to the substrate, thereby reducing its risk of failure under high-temper...Show More
Three-phase LLC small-signal modeling and fast-response control design
2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC)
Year: 2022 | Conference Paper |
Cited by: Papers (2)
In this paper, a design method of controller parameters is proposed for the controller of three-phase LLC resonant converter, which considers the influence of the peak of the amplitude-frequency characteristics of the converter on the stability of the system, and the controller parameters designed on this basis can realize the fast dynamic response speed of the system. In this paper, the small-sig...Show More
Analytical Model of the Parallel-Connected Silicon Carbide MOSFET Turn-ON Switching Behavior Under Asynchronous Gate Signals
Chen Wang;Shuang Zhao;Jianing Wang;Helong Li;Yuqi Wei;Homer Alan Mantooth
2022 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific)
Year: 2022 | Conference Paper |
Cited by: Papers (4)
Parallel-connected power device is an extensively applied solution in the industry to increase the current rating of the converter system compared with using high-power modules. However, due to the undesired PCB layout or semiconductor fabrication tolerance, mismatched drain-source current (Ids) which speeds up the aging process of a specific device can be introduced. The application of silicon ca...Show More
Temperature- and Degradation-Dependent Maximum Electric Field Stress in Wire-Bonding Power Modules Under PWM Waves
Ying Lin;Yunxiao Zhang;Yuhao Liu;Kangning Wu;Helong Li;Jianing Wang;Kejie Li;Lijian Ding
Electric field stress concentration is one of the causes of partial discharge (PD) in power modules, which threatens the power modules’ safe operation. Herein, this article investigates the influences of temperature (from 150 to $250~^{\circ }\text{C}$ ) and operation duration on the maximum electric field stress at the triple point (silicone elastomers, ceramic, and copper). It reveals that the ...Show More
In-Depth Design and Multiobjective Optimization of an Integrated Transformer for Five-Phase LLC Resonant Converters
Jianing Wang;Jiawen Hu;Wei Pei;Zhiqing Yang;Jiacai Zhuang;Xing Zhang
High-power isolated dc–dc converters are preferred in the medium-voltage cascaded H-bridge (CHB) photovoltaic (PV) generation systems due to high power density and galvanic isolation. However, high-power transformers in dc–dc converters can result in high power losses and poor heat dissipation due to thick isolation materials. The three-phase LLC (3P-LLC) converter has been reported suitable for h...Show More
Power Cycling Capabilities of Bond Buffer Technologies for Wide Bandgap Power Devices
2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
Year: 2021 | Conference Paper |
Wide bandgap power devices with excellent performance over traditional silicon power devices have been introduced as the prime candidate for power electronics applications. However, interconnections on the chip topside in the traditional packaging are now limiting the lifetime of wide bandgap power devices. It is necessary to replace Al bond wires with Cu bond wires, ribbons, and lead-frames with ...Show More
The Method for Decoupling the Parasitic Inductance of the Laminated Busbar with SiC MOSFETs in Parallel
Shaolin Yu;Jianing Wang;Xing Zhang;Yuanjian Liu;Zhaoyang Wei
2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
Year: 2021 | Conference Paper |
Cited by: Papers (2)
Discrete Silicon Carbide (SiC) MOSFETs are usually used in parallel to enhance the current capability for medium and high-power application. However, the rough design of the busbar structure may lead to an asymmetric parasitic inductance of the parallel branches., which can further cause the current imbalance. Thus, a symmetrical busbar design is critical for the parallel application of the discre...Show More
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