Design and Analysis of Weather Parameters Using MEMS Technology with Suitable Characteristics for Integration into a Single Chip for Environment Monitoring

This study designs and simulates weather parameters using MEMS technology with suitable characteristics for integration into a single chip for environment monitoring. The sensing and heating filament of the temperature sensor was designed using a thin film platinum resistor, examining its ability to experience stability, increase in resistivity, accuracy, and free-contamination. The temperature sensing and heating element are based on platinum RTD (Resistance Temperature Detector) with meander shape and aluminum as the bonding pad connecting the sensor to the external circuit. A capacitive humidity sensor is implemented in consolidation with a piezoresistive pressure sensor with a square membrane. The capacitive humidity sensor with hole pattern at the upper plate and a polyimide serves as water absorbent sandwiched between the electrodes. The simulation analysis was conducted using finite element analysis in COMSOL Multiphysics version 6.0 . It was observed that the temperature increases from -100oC to - 20oC, and 10oC to 50oC respectively as a result of deviation in relative humidity in the troposphere, and atmosphere. The average changes in capacitances were found at 0.0713/%RH, while the pressure was examined to vary from 1050hPa to 5hPa in a step of 200hPa with a sensitivity of 11.50mv/bar.