Design and Reliability Analysis of Spaceborne Microsystem SiP

System-in-Package (SiP) is a technology that integrates multiple functional chips into a single substrate through micro-assembly, offering advantages such as compact size, high packaging efficiency, compatibility, and low power consumption. As a crucial control component for satellite in orbit, the spaceborne processor requires high performance integration and compactness. Utilizing SiP to form a microsystem with the spaceborne processor can efficiently fulfill these requirments. However, as the integration level and signal frequency increase, SiP must address signal integrity and power supply stability concerns to ensure its reliability. Furthermore due to the long-term reliability demands of aerospace SiP in specific environments, optimizing the packaging process is necessary, alongside enhancements in heat dissipation and mechanical stability. This paper presents the design of a microsystem SiP tailored for spaceborne processors, accompanied by simulation analysis to evaluate its signal integrity, power integrity, heat dissipation, and stress-all of which conform to the reference standards.