High Thermal Conductivity AlN Films for Advanced 3D Chiplets

A novel “Cool 3D chiplet” concept is proposed, showcasing remarkable heat dissipation through the integration of aluminum nitride (AlN), an insulating material with high thermal conductivity. We conducted simulations analyzing the thermal impact of AlN as an interlayer dielectric (ILD) for the back-side power delivery network (BSPDN), a TSV insulating film, and a molding material for the packaging. Furthermore, we explored appropriate AlN deposition techniques for each application. The results demonstrate the feasibility of building advanced 3D chiplets with enhanced heat dissipation by employing the AlN in each layer that makes up the 3D chiplet, from the device level to the packaging level.