Extremely low-inductance series-connected power module enabled by insulation packaging enhancement

Parasitic inductance is a major obstacle to improving power levels. To achieve higher instantaneous power output, the pulsed generators put forward higher requirements for low parasitic inductance design of devices. Due to insufficient insulation ability, the packaging insulation materials of commercially available modules are no longer able to support further compact designs of power modules. Therefore, we proposed a series of modification methods for the insulating packaging materials of a series-connected high-voltage power module. By increasing the flashover and body breakdown voltage of the packaging materials, the insulation margin of the MOSFET series-connected circuit is improved. So that when the insulation is fully utilized, the parasitic inductance of the power loop of the 6-level/10kV series-connected module is reduced to less than 15 nH. At the same time, packaging material leakage current can also be maintained at a low level.