A High Performance Miniaturized 25 GHz Band Pass Filter Using Multilayer Split Path IPD Inductor for 5G/6G Radio Applications

This Simulation and fabrication of an efficient small size onchip CMOS Bandpass Filter (BPF) for the 5G/UWB/6G Radio Frequency Front End (RFFE) solution, using the Integrated Passives Device (IPD) technology, is explored in this paper. Technology driven miniaturization led to regular size reductions for electronic devices and ICs. A novel high-performance series stacked multilayer inductor possessing minimum onchip area is developed at 25 GHz 5G/UWB/6G band. The proposed 0.01 mm2 3-layer IPD inductor showed excellent improvements of 64% and 43% of inductance and quality factor respectively, against the inductors of recent past. The proposed 0.016 mm2 planar capacitor also showed capacitance and quality factor improvements of 10.5% and 25.8% respectively over the capacitors in literature. A low cost first order LC resonator BPF circuit is optimized and simulated at 25 GHz, by using High Frequency Simulation Software (HFSS). This filter yielded very good performance enhancements: Q factor of 16.67, very small 6% fractional bandwidth, very low −0.36 dB insertion loss, −23.43 dB return loss and finally very small chip area of only 0.032 mm2. Proposed IPD passives are fabricated by scaling down to mm scale, because of the PCB fabrication difficulty at nm scale. The mm level downscaled and fabricated LC resonator BPF is tested on Agilent network analyzer (VNA-N9923A). The PCB measured results of the BPF are in very good concurrence with simulation results, with errors less than 2.5%. Thus, the improved performance of proposed compact and low cost 25 GHz BPF is validated from the successful results. These superior parameter enhancements, clearly prove the best suitability of proposed IPD BPF, for Radio Frequency Integrated Circuit (RFIC) applications at 25 GHz (5G NR-n258, UWB automotive SRR, 6G UTM, and IEEE 802.16 WiMAX).