Polarization Based Optical Microscopy for Better Resolution

It is very important and challenging work to investigate the damage to PCB boards and semiconductor devices. We can investigate the defect but a major problem will come with the resolution of images. To know the inspection of the micro defect in waveguide wafer and line edge inspection requires a high-resolution optical microscope. As a step toward this goal, the present work is reporting the inspection of the micro defect in patterned integrated waveguide wafer line-edge analysis by Super-Resolution Parametric Indirect Microscopic Imaging (PIMI). Previously developed Sub nanometer resolution imaging techniques such as Atomic Force Microscope (AFM) and Scanning Electron Microscope (SEM) can cause harmful damage to the sample, and it is more expensive, time is taken imaging system. Optical microscopy has better imaging efficiency, low cost, easy manufacture. However, optical microscopes still have to overcome a critical limit in optical resolution caused by the diffraction of visible light. It can investigate the defect in the printed circuit.