Hybrid Model-Based Thermal Analysis Methodology for Integrated Circuits

Modern high performance computing chips, such as SoC and CPU, are requiring higher hash rate, which accelerates the integration level of integrated circuits. As the Dennard's law no longer holds, the power density of integrated circuits also increases with the level of integration, which results in the fact that the thermal issue is becoming one of the most important issues limiting the development of integrated circuits. To tackle this problem, a fast thermal analysis methodology for integrated circuits is needed. In this paper, we presents a fast on-chip thermal analysis methodology using a hybrid thermal model. The hybrid thermal model is the combination of the detailed on-chip model and the compact model for the package. We propose a novel thermal analysis flow that separates the construction and reduction of the package from the on-chip thermal simulation. Once the compact thermal model of the package has been extracted, we can combine it with any detailed model of the chip to perform fast thermal simulation. The experimental results show that our hybrid model achieves a 28X speedup without any accuracy loss compared to solving the complete detailed model directly.