Active Power Cycling of SiC Modules Extended by Long-Term Monitoring of After Test

In this paper, overview of Active Power Cycling (APC) test of SiC half-bridge modules is presented. Description covers all key practical aspects of Accelerated Lifetime Testing, from setting up the APC test, through post failure analysis of SiC modules, ending up on identification theirs reliability model. Post failure analysis consists of distinction of soft-failure and hard-failure, electrical measurement, Confocal Scanning Acoustic Measurement (C-SAM) and pull-wire shear test. In addition, D UTs were monitored for over 14 weeks after APC test to verify if there is any further change is SiC modules electrical parameters, which revealed continuous decay of MOSFET's
$V_{GSTH}$
.