Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages

Signal conversion between different layers of high-speed interconnect links will cause serious noise and crosstalk problems. This paper presents a hybrid fast modeling approach to efficiently analyze the port conversion of via-connected microstrip and strip lines in multilayer electronic package structures. The results indicate that our method can efficiently analyze the transmission and crosstalk parameters of via-connected traces. Further, the impact of different ground via layouts is presented, which demonstrates a prospect for automatic optimization design.