I. Introduction
With the continuous upgrading of electronic equipment, the integration degree of high-power and high-frequency electronic equipment also increases[1], and the calorific value of electronic equipment increases exponentially, which not only increases the energy consumption of equipment, but also seriously affects the performance of equipment [2], which puts forward higher requirements for equipment liquid cooling system. At present, the advanced equipment electronic equipment presents the development trend of multi-pump parallel, centralized heat dissipation and efficient circulation.