Develop new solder alloy for high reliability device

This research introduces PF918, a novel lead-free solder alloy designed to enhance the reliability of solder joints in automotive electronics, a field that demands high durability due to exposure to extreme conditions. This research compares the newly developed PF918 with the traditional SAC305 alloy. The investigation employs a series of tests that simulate the harsh operational conditions faced by automotive electronics. Findings from the study indicate that PF918 exhibits a slower growth rate of intermetallic compound (IMC) formation compared to SAC305. The study assesses the performance of PF918 through thermal cycle testing (TCT) and drop tests, critical measures for evaluating solder joint durability under typical automotive operational stresses. TCT results show that PF918 exhibits a notable resistance to thermal fatigue, with a slower rate of IMC growth compared to SAC305, indicating a potential for enhanced joint reliability over extended periods. The paper concludes that PF918 presents a significant advancement in solder technology for the automotive industry.