Hybrid Systems in Foil: Merging the Best of Two Worlds

Large-area flexible electronic components can favorably be combined with ultrathin highly integrated silicon (Si) chips by jointly integrating and interconnecting them on a flexible substrate carrier. The resulting hybrid system in foil (HySiF) thus allows for merging the best of two worlds, resulting in a highly complex and high-performance flexible electronic system. This article addresses the concept, with advantages and challenges of HySiFs in terms of their electronic and mechanical aspects. Also addressed are three generic application cases along with manufacturing aspects.