Design of a X-band miniaturized T/R module based on LTCC substrate

This article designs a novel, small Transmit/Receive (T/R) module in X-band. The key technology lies in the realization of signal vertical interconnection to increase the assembly density of the module. The microwave circuit and the control circuit are implemented on different layers of the Low-temperature co-fired ceramic (LTCC) substrate. In addition, combined with Monolithic Microwave Integrated Circuits (MMIC) technology, the size of the module is reduced through bare dies. Finally, the single-channel transmission power can reach 45dBm, and the gain is guaranteed to above 40dB. The noise figure of the single-channel receiving branch is also within 3dB.