Investigating Novel 3D Modular Schemes for Large Array Topologies: Power Modeling and Prototype Feasibility

This paper presents the Tiled Computing Array (TCA), a simple, uniform, 3D-mesh packaging at inter-board level, for massively parallel computers. In particular, the power modelling and practical feasibility of the system is examined. TCA eliminates the need for hierarchical rackmount-structures and introduces short and immediate data channels in multiple physical orientations, allowing a more direct physical mapping of 3D computational topology to real hardware. A dedicated simulation platform has been developed, and an engineered prototype demonstrator has been built. This paper explores the feasibility of the TCA concept for current hardware technologies and systems, evaluates power modeling and validation, and highlights some of the novel design challenges associated with such a system. Evaluations of physical scalability toward large-scale systems are reported, showing that TCA is a promising approach.