Simulation of interface thermal properties and optimization methods of Al2O3/ EP composites

The heat dissipation of power equipment is a major issue affecting the insulation performance of the equipment, and the interface thermal resistance is an essential factor in determining the thermal conductivity of materials. In addition to traditional experimental research methods, molecular dynamics simulation of thermal conductivity is a promising method. In this paper, the interface thermal properties of $Al_{2}O_{3}$/EP composites were simulated by molecular dynamics. The simulation results showed that, compared with KH550, $Al_{2}O_{3}$/EP modified by KH560 had higher interface binding energy, stronger interface attraction, thicker interface transition layer and better compatibility. The thermal conductivity of $Al_{2}O_{3}$/EP modified by KH560 coupling agent was also better than that of KH550. By studying the molecular dynamics of interface thermal properties, a relatively better modification method can be selected to reduce interface thermal resistance and ultimately improve the thermal properties of composite materials.