Enhanced Interconnect Test Method for Resistive Open Defects in Final Tests with Relaxation Oscillators

Resistive open defects may occur at interconnects between a printed circuit board and ICs in solder process. An enhanced test method in final tests and a built-in test circuit are proposed to detect resistive open defects of small resistance with relaxation oscillator embedded in ICs in this paper. It is examined by Spice simulations what resistive open defects can be detected. The results show that resistive open defects of 23.4 Ω and above are detected by the test method in a test speed of 1 MHz per an interconnect.