A highly integrated on-line monitoring system for RF applications

A highly integrated monitoring system based on the system in packaging (SIP) technology is investigated. The BGA packaged monitoring chip with dimensions of 1 cm
$\times 1$
cm is designed and fabricated successfully. The operation frequency of the system is 0.1-18 GHz and the advised detected power is ranged from -14 to 2 dBm. Experiments show that the approximate piecewise linear relationships between the output voltage change and the input RF power are obtained. Results also demonstrate that the sensitivity is calculated to be 0.04 dBm and the environmental adaptability from -50 °C to 70 °C is good, indicating that the monitoring system is suitable for almost all RF applications such as 5G communication radio, 5G-IOT, radar, and industrial microwave heating.