Deep Learning for Semiconductor Defect Classification

Automated inspection has become a vital part of quality control during semiconductor wafer production. Current processes are focused on finding defects via variation from a ‘golden' image using pixel to pixel comparisons or utilization of opaque neural network-based approaches. In this paper we present an approach which uses deep learning methods to classify defects on semiconductor die images and show the experimental steps taken in order to produce a highly accurate system based on previous models.