High Linear and Temperature Insensitive GaAs Power Amplifier Operating at 3.3–3.6 GHz Using a Multi-Feedback Branch Bias Circuit

This letter describes a design of a 3.3–3.6-GHz GaAs heterojunction bipolar transistor (HBT) power amplifier (PA) with high linearity and temperature insensitivity for the fifth-generation (5G) of new radios (NRs). By involving a multi-feedback branches bias circuit, the voltage at the feedback node of the bias circuit can achieve dynamic self-tuning to stabilize the base voltage as the amplifier’s input power grows and stabilize the bias current as the temperature increases as well. A three-stage common source structure PA in the form of a monolithic microwave integrated circuit (MMIC) is designed using a multi-feedback branch bias circuit with a size of
$1.5\times1.2$
mm. Measured with continuous wave (CW) signals, the output 1-dB compression point at 3.3–3.6 GHz is 34 dBm. The linearity of the PA is also evaluated using a 5G-NR 100-MHz 64-quadratic-amplitude modulated (QAM)-orthogonal frequency division multiplexing (OFDM) signal with a 7-dB peak-to-average-power ratio (PAPR). The proposed PA achieves an adjacent channel power ratio (ACPR) less than −49.5 dBc at an average power of 28 dBm with a power-added efficiency (PAE) of 20% without the use of digital pre-distortion (DPD). In the temperature range of
$- 40\,\,^{\circ }\text{C}$
to 120 °C, the variance of bias current, small signal gain, PAE, output power at 1-dB compression point (OP1dB), and ACPR is relatively minor. This design is ideally suited for 5G communication systems due to its high linearity and temperature insensitivity.