Evaluation of Lifetime of Through-Hole Solder Joints Considering Mounting Process and Variation

In recent years, electronic devices have been widely used in various industrial fields due to the rapid development of electronics. The automotive industry is no exception, with a large number of electronic components in use. In addition, the trend toward electrification is also becoming more pronounced in large machinery such as construction and mining equipment. In these machines, large through-hole components are used, and lead-free solder is now used instead of the conventional Sn-Pb solder. The use of lead-free solder has been shown to increase the variation of solder shape at the solder joint due to the increase in mounting temperature and the difference in solder characteristics, and there is concern that this variation in shape may affect the quality of large machines.In this study, the effects of variations in the shape and material properties that can occur in solder joints on fatigue life were evaluated using CAE simulations. In addition, we focused on the shape of the solder, which is controllable among these variations, and examined the mounting process to ensure the shape.