The 3D Tesla Valve Manifold Two-Phase Cold Plate for the SiC Power Device Module

Due to the geometry limitation of the miniaturized cooling architectures, it is difficult to integrate the complex flow field regulates. As a simple passive check valve, the Tesla valve bifurcation structure can preponderantly prevent the nucleation bubble slugs blocking the channels and enhance the fluidic disturbance. In this paper, a double-layer manifold two-phase copper cold plate (47.7 mm × 36 mm × 2.5 mm) was composed by the forward and reverse multistage interweaving Tesla valves configuration. A SiC power device half-bridge circuit on the SiC high purity half semi-insulation substrate was mounted on the cold plate through the sliver sintering. During the half- bridge circuit operations, the highest heat power of each SiC diode was about 360 W (375 W/cm
²
heat flux density). Those heat would form a gas-liquid mixing bubbly flow (more than 10 % dispersed phase volume fraction) inside the Tesla valve manifold. Through the cold plate top surface temperature distribution measurements, the temperature uniformity and heat dissipation performance of the fabricated Tesla valve cold plate was investigated. The temperature uniformity of each SiC diode on the Tesla valve cold plate could be maintained at ± 5 ℃. The top surface temperatures of the SiC diodes on the Tesla valve cold plate were about 210 ℃ under the two-phase flow condition. Such staggered Tesla valve manifold can be straightforwardly integrated into other compact electronics packages.