I. Introduction
There is an ongoing need to develop efficient, high performance thermal management technologies to meet the challenges of increasing information & communication technology (ICT) hardware global energy consumption and power densities.
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There is an ongoing need to develop efficient, high performance thermal management technologies to meet the challenges of increasing information & communication technology (ICT) hardware global energy consumption and power densities.
IEEE Transactions on Components and Packaging Technologies
Published: 2003
IEEE Transactions on Components and Packaging Technologies
Published: 2005
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