High performance compact power divider based on TSV

A high-performance compact power divider based on through-silicon via (TSV) is proposed in this work. The length of the transmission line is set to one-twelfth wavelength and the proposed circuit is realized with TSV technology, because TSV is beneficial to improve performance and reduce size. The result shows that at the center frequency of 30GHz, the return loss S11 is -63dB. From 10GHz to 42GHz, the S11 is below -10dB. The insertion loss S21 is -3dB at the center frequency. Isolation S23 is -43dB, and S23 is below -10dB from 18GHz to 43GHz. In addition, the area of the proposed power divider is only 0.03mm
²
.