High-Reliability Bonding by Nano-Silver Paste with Tin Addition for High Temperature Electronic

A high-reliability bonding used by nano-silver (nano-Ag) paste with tin (Sn) was proposed in the paper. The transient liquid phase (TLP) bonding was combined with the Ag NPs sintering technology to shorten the sintering time and improve the high-temperature reliability of the bond line. After bonding, the Ag-Sn joint could form a full Ag
3
Sn structure. After aging, almost no pores and cracks could be observed at the interface of the Ag-Sn joint, and the Sn diffused to the Cu substrates to form Cu-Sn intermetallic compounds (IMCs), which prevents the Cu substrate from being oxidized and delaminated. The original shear strength of Ag-Sn joint is 23.7 MPa, which is 19.7% higher than the nano-Ag one. Meanwhile, the shear strengths of Ag-Sn joints are always higher than that of the nano-Ag joints at different aging time. The results indicate that the Ag-Sn joint possesses high reliability and the nano-Ag paste with Sn has great research significance as a die-attach material for high power device packaging.