Research on quality and reliability of ceramic-to-metal bonding without solder

The bonding methods of ceramic / metal in vacuum electronic devices can be divided into two ways: with solder and without solder. Among them, the way with solder has been relatively mature, but with the progress of Technology, the non solder bonding technology with the simple structure has gradually developed.Because the reliability of its bonding has a great impact on the performance of the device and the whole machine, it is necessary to further study the quality and reliability of this bonding method.Through the research, the tensile strength is evaluated by making standard parts and the manufacturing process is further characterized by scanning electron microscope & element distribution test. From comparative testing, solderless devices have higher tensile strength than solder bonding devices, clear layers of micro materials, less layers, and high quality and reliability.