A novel 3D plastic packaging technology with high overload ability and its application in microsystem

In this paper, a 3D plastic packaging technology based on 2D-MCM stacking was proposed. Through PGA and embedded nut structure, the reliability of electrical interconnection between the module and PCB in high overload environment could be improved. The finite element simulation result of the maximum stress of the 3D plastic packaging module under 20000g impact was 132.62 MPa, which was mainly distributed in embedded nuts area, while the stress of the PGA position was lower than 20 MPa. An anti-impact inertial navigation microsystem module was developed, which integrated a computing unit, an IMU (3-axis accelerometer and 3-axis gyroscope) and a power management unit. The size of the microsystem module was 30mm x 30mm x 8.4 mm. After the temperature cycle of-55 °C ~ 125C and the impact test of 5000g, there were no delamination and cracking in the microsystem module. The firing test was carried out, and the measured result of X-axis acceleration was from -32g to -2g during 30s, and the angular velocity of the wy-axis were -30 °/s to 30 °/s.

I. Introduction

At present, the electronic information system had developed toward multi-function, high performance, miniaturization and lightweight. And the microsystem technology emerged as the times requie. Based on microelectronics technology, optoelectronic technology and micro-electromechanical system (MEMS) technology, the microsystem technology integrated processor, memory, sensor and other functional units by using micro-nano processing technology.