Research on Improving the Delamination of Electronic Packaging Product

With the rapid development of the integrated circuit industry, more and more people regard delamination as an important consideration in evaluating the reliability of electronic packaging products. Aiming at the delamination problem of mass-produced fine-pitch ball grid array (FBGA) product after molding, the ANSYS Workbench simulation software was used to reproduce the position of product delamination, and the stress of product under different structures and material parameters was studied. Then, based on the simulation results, an improvement and optimization scheme is proposed, which finally solves the delamination problem of packaged product. The results show that, for this product, shear stress rather than peel stress is the main contributor to delamination. The higher the coefficient of thermal expansion (CTE) of the adhesive, the lower the shear stress of the encapsulated product and the less likely the product is to delaminate. At the same time, the thinner the die and adhesive, the lower the shear stress of the product. The research results provide a certain reference for solving the delamination problem of electronic packaging products.