Review of thermal characteristics simulation analysis of electronic components

With the rapid development of electronic technology, the integration of electronic equipment has an obvious upward trend compared with the past, and the requirement of miniaturization of electronic equipment is also rising. High power devices are widely used. At the same time, the application environment of electronic equipment is becoming more and more diverse. Under the background of these development trends, the problem of overheating of electronic components is becoming more and more prominent. According to statistical data, in all failed electronic components, the number of failed individuals due to temperature exceeding the limit value exceeds 55%. When the temperature of electronic components increases by 10 ℃ , the reliability decreases by 50%. Overheating seriously limits the performance, reliability and service life of electronic components.To solve the problem of overheating of electronic equipment, it is necessary to study the thermal performance of electronic components, in which thermal analysis and thermal experiment are the main research methods. Thermal analysis is mainly based on the numerical simulation method to simulate the thermal characteristics of electronic components. There are errors between the results of thermal analysis and the actual situation. Both modeling methods and numerical analysis methods have an impact on the error. Thermal analysis is mainly used in the conceptual design stage to provide support for designers to grasp the design direction.This paper sorts out the thermal analysis modeling methods of electronic components, compares the characteristics of different modeling methods, combs the current technical achievements of thermal analysis of electronic components and analyzes the development trend of thermal performance research of components.Thermal analysis simulation modeling still needs to be promoted in dealing with the problem of complex geometry. In order to simulate the thermal characteristics of electronic components more quickly and accurately, it is necessary to simplify the complex geometry with acceptable errors. It is an important direction of thermal analysis simulation to establish the simplification criteria of electronic components and their auxiliary structures and balance the simulation accuracy and calculation scale of the model.The simulation analysis of thermal characteristics of electronic components under extreme environmental conditions is of great value to its application. On the one hand, the application temperature range of electronic components is becoming wider and wider, and the thermal characteristics and mechanisms of electronic components are different in extremely low temperature and extremely high temperature environment. The simulation of extreme temperature environment of electronic components are important research directions in the future.Multiple physical fields coupled thermal analysis is a new research hotspot in recent years. In the application of electronic components, there are many kinds of physical fields coupling effects, such as temperature-structure, temperature-current and so on. The research on the simulation of thermal characteristics of electronic components under coupled multiple physical fields has attracted more and more attention of relevant researchers.The analysis shows that the research on the thermal performance of electronic components is of great significance to improve the performance and reliability of electronic components and heat dissipation design.