Characterization and Simulation of Interfacial Adhesion in Embedded Device Package

In order to improve the performance and long-term reliability of the embedded package, this study carried out a failure risk assessment for the hazardous area of the package. Firstly, experiments are taken to measure the adhesive strength of the key material interfaces (Polyimide/Passivation) in the packaging structure. The critical energy release rate (Gc) of the interface is derived from the measured adhesive strength. Then, finite element simulation is conducted to obtain the energy release rate of the interface cracks at the easily failed parts. The two critical energy release rates gained by the experiment and simulation are compared, and the failure risk of each interface in the temperature cycle test can be evaluated.