Spintronics Technology Solutions for Interferometric Thermal-Electromagnetic Sensing

Hybrid electromagnetic (EM) and thermal imaging using spintronic technologies is proposed for sensing circuits and systems in near-field and far-field from DC (Switching-Power) to mmWave frequencies. High resolution spintronic sensors capable of detecting magnetic fields ranging from few tens of mT (milli-Tesla) down to tens of pT (pico-Tesla) are demonstrated spanning about 10 orders of magnitude in dynamic range. A configurable Agile Front-End-Module LNA (AFEM) is combined with spintronics probe-array sensors providing adjustable 80 dB of dynamic range for subsequent processing of MIMO correlations in time and frequency domains. The proposed hybrid EM-Thermal sensing solution is applied to mmWave beamforming modules demonstrating the possibility of extracting power-density and energy-density metrics as a function of beamforming angles. An infrared (IR)-Visual dual-camera is introduced together with augmented reality (AR) based on 3D non-uniform spatial-sampling. Porting of chemically functionalized spintronic sensing materials into advanced FD-SOI platforms is proposed using advanced MRAM/SRAM process technologies.